SMT :surface mount technology
封裝﹕ Package
貼片﹕ Pick and Place
拆焊﹕ Desoldering
再流﹕Reflow
浸焊﹕ Dip Soldering
拖焊﹕ Drag soldering
印制電路﹕Printed Circuit
印制線路﹕ Printed Wiring
印制電路板﹕ printed circuit board
印制線路板﹕printed wiring board
層壓板﹕laminate
覆銅銅薄層壓板﹕copper-clad laminate
基材﹕base material
成品板﹕production board
印刷﹕printing
導(dǎo)電圖形﹕conductive pattern
印制元件﹕printed component
單面印制板﹕single-sided printed board
雙面印制板﹕double-sided printed board
多層印制板﹕multilayer printed board
電烙鐵﹕ Iron
熱風(fēng)嘴﹕ hot air reflowing noozle
吸錫帶﹕soldering wick
吸錫器﹕tin extractor
焊后檢驗(yàn)﹕post-soldering inspection
目視檢驗(yàn)﹕visual inspection
機(jī)器檢驗(yàn)﹕ machine inspection
焊點(diǎn)質(zhì)量﹕ soldering joint quality
焊電缺陷﹕ soldering jont defect
錯(cuò)焊﹕ solder wrong
漏焊﹕ solder skips
虛焊﹕ pseudo soldering
冷焊﹕ cold soldering
橋焊﹕ solder bridge
脫焊﹕ open soldering
焊點(diǎn)剝離﹕ solder off
不潤(rùn)濕焊點(diǎn)﹕ soldering nonwetting
錫珠﹕ solder ball
拉尖﹕ icicle ； solder projection
孔洞﹕ void
焊料爬越﹕ solder wicking
過(guò)熱焊點(diǎn)﹕ overheated solder connection
不飽和焊點(diǎn)﹕ insufficient solder connection
過(guò)量焊點(diǎn)﹕ excess solder connection
助焊劑剩余﹕ flux residue
焊料裂紋﹕ solder crazeing
焊角翹起﹕ fillet-lifting ；lift-off
AI :Auto-Insertion 自動(dòng)插件
AQL :acceptable quality level 允收水準(zhǔn)
ATE :automatic test equipment 自動(dòng)測(cè)試
ATM :atmosphere 氣壓
FAI:First Article Inspection (quality check) 首件檢驗(yàn)
BGA :ball grid array 球形矩陣
CCD :charge coupled device 監(jiān)視連接元件(攝影機(jī))
CLCC :Ceramic leadless chip carrier 陶瓷引腳載具
COB :chip-on-board 晶片直接貼附在電路板上
cps :centipoises(黏度單位) 百分之一
CSB :chip scale ball grid array 晶片尺寸 BGA
CSP :chip scale package 晶片尺寸構(gòu)裝
CTE :coefficient of thermal expansion 熱膨脹系數(shù)
DIP :dual in-line package 雙內(nèi)線包裝(泛指手插元件)
FPT :fine pitch technology 微間距技術(shù)
FR-4 :flame-retardant substrate 玻璃纖維膠片(用來(lái)製作 PCB 材質(zhì))
IC :integrate circuit 積體電路
IR :infra-red 紅外線
Kpa :kilopascals(壓力單位)
LCC :leadless chip carrier 引腳式晶片承載器
MCM :multi-chip module 多層晶片模組
MELF :metal electrode face 二極體
MQFP :metalized QFP 金屬四方扁平封裝
NEPCON :National Electronic Package and
Production Conference 國(guó)際電子包裝及生產(chǎn)會(huì)議
ppm:parts per million 指每百萬(wàn) PAD(點(diǎn))有多少個(gè)不良 PAD(點(diǎn))
psi :pounds/inch2 磅/英吋 2
PWB :printed wiring board 電路板
QFP :quad flat package 四邊平坦封裝
SIP :single in-line package
SIR :surface insulation resistance 絕緣阻抗
SMC :Surface Mount Component 表面貼裝元件
SMD :Surface Mount Device 表面貼裝元件
SMEMA :Surface Mount Equipment
Manufacturers Association 表面貼裝設(shè)備製造協(xié)會(huì)
SOIC :small outline integrated circuit
SOJ :small out-line j-leaded package
SOP :small out-line package 小外型封裝
SOT :small outline transistor 電晶體
SPC :statistical process control 統(tǒng)計(jì)過(guò)程控制
SSOP :shrink small outline package 收縮型小外形封裝
TAB :tape automaticed bonding 帶狀自動(dòng)結(jié)合
TCE :thermal coefficient of expansion 膨脹(因熱)係數(shù)
Tg :glass transition temperature 玻璃轉(zhuǎn)換溫度
THD :Through hole device 須穿過(guò)洞之元件(貫穿孔)
TQFP :tape quad flat package 帶狀四方平坦封裝
UV :ultraviolet 紫外線
uBGA :micro BGA 微小球型矩陣
cBGA :ceramic BGA 陶瓷球型矩陣
PTH :Plated Thru Hole 導(dǎo)通孔
IA Information Appliance 資訊家電產(chǎn)品
MESH 網(wǎng)目
OXIDE 氧化物
FLUX 助焊劑
LGA (Land Grid Arry)封裝技術(shù) LGA 封裝不需植球，適合輕薄短小產(chǎn)品
應(yīng)用。
TCP (Tape Carrier Package)
ACF Anisotropic Conductive Film 異方性導(dǎo)電膠膜製程
Solder mask 防焊漆
Soldering Iron 烙鐵
Solder balls 錫球
Solder Splash 錫渣
Solder Skips 漏焊
Through hole 貫穿孔
Touch up 補(bǔ)焊
Briding 穚接(短路)
Solder Wires 焊錫線
Solder Bars 錫棒
Green Strength 未固化強(qiáng)度(紅膠)
Transter Pressure 轉(zhuǎn)印壓力(印刷)
Screen Printing 刮刀式印刷
Solder Powder 錫顆粒
Wetteng ability 潤(rùn)濕能力
Viscosity 黏度
Solderability 焊錫性
Applicability 使用性
Flip chip 覆晶
Depaneling Machine 組裝電路板切割機(jī)
Solder Recovery System 錫料回收再使用系統(tǒng)
Wire Welder 主機(jī)板補(bǔ)線機(jī)
X-Ray Multi-layer Inspection System X-Ray 孔偏檢查機(jī)
BGA Open/Short X-Ray Inspection Machine BGA X-Ray 檢測(cè)機(jī)
Prepreg Copper Foil Sheeter P.P. 銅箔裁切機(jī)
Flex Circuit Connections 軟性排線焊接機(jī)
LCD Rework Station 液晶顯示器修護(hù)機(jī)
Battery Electro Welder 電池電極焊接機(jī)
PCMCIA Card Welder PCMCIA 卡連接器焊接
Laser Diode 半導(dǎo)體雷射
Ion Lasers 離子雷射
Nd: YAG Laser 石榴石雷射
DPSS Lasers 半導(dǎo)體激發(fā)固態(tài)雷射
Ultrafast Laser System 超快雷射系統(tǒng)
MLCC Equipment 積層元件生產(chǎn)設(shè)備
Green Tape Caster, Coater 薄帶成型機(jī)
ISO Static Laminator 積層元件均壓機(jī)
Green Tape Cutter 元件切割機(jī)
Chip Terminator 積層元件端銀機(jī)
MLCC Tester 積層電容測(cè)試機(jī)
Components Vision Inspection System 晶片元件外觀檢查機(jī)
高壓恆溫恆濕壽命測(cè)試機(jī) High Voltage Burn-In Life Tester
電容漏電流壽命測(cè)試機(jī) Capacitor Life Test with Leakage Current
晶片打帶包裝機(jī) Taping Machine
元件表面貼裝設(shè)備 Surface Mounting Equipment
電阻銀電極沾附機(jī) Silver Electrode Coating Machine
TFT-LCD(薄膜電晶體液晶顯示器) 筆記型用
STN-LCD(中小尺寸超扭轉(zhuǎn)向液晶顯示器 行動(dòng)電話用
PDA(個(gè)人數(shù)位助理器)
CMP(化學(xué)機(jī)械研磨)製程
研磨液(Slurry)，
Compact Flash Memory Card (簡(jiǎn)稱 CF 記憶卡) MP3、PDA、數(shù)位相機(jī)
Dataplay Disk(微光碟)。
交換式電源供應(yīng)器(SPS)
專業(yè)電子製造服務(wù) (EMS)，
PCB
高密度連結(jié)板（HDI board， 指線寬／線距小于 4／4 mil）微小孔板（Micro-via board），孔
俓 5-6mil 以 下 水溝效應(yīng)（Puddle Effect）: 早期大面積鬆寬線路之蝕刻銀貫孔(STH)銅貫孔
(CTH)
組裝電路板切割機(jī) Depaneling Machine
NONCFC＝無(wú)氟氯碳化合物。
Support pin＝支撐柱
F.M.＝光學(xué)點(diǎn)
ENTEK 裸銅板上涂一層化學(xué)藥劑使 PCB 的 pad 比較不會(huì)生鏽
QFD: 品質(zhì)機(jī)能展開(kāi)
PMT: 產(chǎn)品成熟度測(cè)試
ORT: 持續(xù)性壽命測(cè)試
FMEA: 失效模式與效應(yīng)分析
TFT-LCD(薄膜電晶體液晶顯示器) (Liquid-Crystal Displays Addressed by Thin-Film Transistors)
導(dǎo)線架（Lead Frame）: 單體導(dǎo)線架（Discrete Lead Frame）及積體線路導(dǎo)線架（IC Lead Frame）
二種
ISP 的全名是 Internet Service Provider，指的是網(wǎng)際網(wǎng)路服務(wù)提供
ADSL 即為非對(duì)稱數(shù)位用戶迴路數(shù)據(jù)機(jī)
SOP: Standard Operation Procedure（標(biāo)準(zhǔn)操作手冊(cè)）
DOE: Design Of Experiment （實(shí)驗(yàn)計(jì)劃法）
打線接合（Wire Bonding）
捲帶式自動(dòng)接合（Tape Automated Bonding, TAB）
覆晶接合（Flip Chip）
品質(zhì)規(guī)范:
JIS 日本工業(yè)標(biāo)準(zhǔn)
ISO 國(guó)際認(rèn)證
M.S.D.S 國(guó)際物質(zhì)安全資料
FLUX SIR 加溼絕緣阻抗值
1. RMA (Return Material Authorization)維修作業(yè)
意指產(chǎn)品售出后經(jīng)由客戶反應(yīng)發(fā)生問(wèn)題的不良品維修及分析。
Automatic optical inspection (AOI 自動(dòng)光學(xué)檢查)
上板機(jī): Loader
下板機(jī): unloader
滴涂器: dispenser
點(diǎn)膠機(jī): dispenser
真空吸筆: vacuum pick & place tool
貼片機(jī): place machine ；chip mounter
波峰焊接機(jī): wave soldering systems
再流焊爐: reflow soldering systems
自定位: self – aligment
位移: skewing
立片: tomb stone
掉片: flying
在線測(cè)試: ict；in cricult testing
功能測(cè)試: funtion testing
自動(dòng)光學(xué)檢測(cè)儀: AOI ；automated optical inspection
自動(dòng) X 射線檢查: AXI ；automated X-ray inspection
返工工作臺(tái): rework station
清洗機(jī): cleaning systems
